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MNS Microwave Chip Capacitors
MA4M Series
MA4M Series
MNS Microwave Chip Capacitors
Features
* Excellent Repeatability (Wafer-to-Wafer and Lot-to-Lot) * Small Size * Low Loss, High Q * Available with Round or Square Bonding Pads
Case Style
Description
M/A-COM's MA4M series of MNS (metal-nitride-silicon) silicon chip capacitors is designed specifically for high reliability and repeatable performance in microwave circuit applications. These capacitors are made using a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These capacitors exhibit higher capacitance per unit area (resulting in smaller chip size) than similar MOS, MIS and ceramic capacitors. Evaporated gold contacts are used to provide an easily bondable metal pad on the capacitor chip. M/A-COM MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage of 150C. The MA4M series of chip capacitors is an excellent choice for use in hybrid microwave circuits up through Ku-band, where low loss, high reliability, small size and temperature stability are prime concerns. These chip capacitors are suited for applications requiring DC blocks, coupling capacitors, bypass capacitors, capacitive loads and tuning elements in oscillators, multipliers and filters.
350
Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors
Characteristics Compared Operating Temperature Range Temperature Coefficient Insertion Loss of a 20 pF Capacitor in a 50 line at 15 GHz Chip Size 200 pF, 100V 20 pF, 100V MNS -55 to +200C 180 PPM 0.1 dB 40 x 40 mils 22 x 22 mils Ceramic -55 to +125C 1000 PPM 0.2 dB 70 x 70 mils 50 x 50 mils
V3.00 M/A-COM Division of AMP Incorporated s North America: Tel. (800) 366-2266, Fax (800) 618-8883 s Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 s Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Specifications
Chip Capacitors with Round Bonding Pads Maximum Standoff Capactance Voltage 2,5 1,2,3,4 Rating (pF) (Volts) 10 % 2 5 10 20 20 30 50 80 100 100 200 250 300 300 600 200 200 100 100 200 100 100 100 100 200 100 100 100 200 100 Nominal Top Contact Diameter (mils) 3.5 6.0 6.0 9.0 11.5 11.0 14.0 18.0 20.0 26.0 28.0 32.0 35.0 45.0 48.0 Chip Capacitors with Square Bonding Pads Maximum Standoff Voltage 2,5 Rating (Volts) 200 200 200 200 50 50
Model Number MA4M2002 MA4M2005 MA4M1010 MA4M1020 MA4M2020 MA4M1030 MA4M1050 MA4M1080 MA4M1100 MA4M2100 MA4M1200 MA4M1250 MA4M1300 MA4M2300 MA4M1600
Chip Style 132 132 132 132 132 132 132 199 199 200 200 200 201 263 263
Model Number MA4M3010 MA4M3020 MA4M3030 MA4M3050 MA4M3100 MA4M3150
Capactance 1,2,3,4 (pF) 10 % 10 20 30 50 100 150
Chip Style 350 351 352 354 358 359
Notes: 1 5% capacitance tolerance is available on request. 2 Other capacitance and standoff voltage values are available on request. 3 Capacitance is measured at 1 MHz. 4 Temperature coefficient of capacitance is nominally 180 PPM/C. 5 Device failure may occur if standoff voltage ratio is exceeded.
Maximum Ratings
Applied Voltage Operating Temperature Storage Temperature Specified standoff voltage -55C to +200C -55C to +200C
TYPICAL CAPACITANCE CHANGE FOR MNS and CERAMIC CAPACITOR vs TEMPERATURE (200 pF CAPACITOR)
+10 +8 +6 +4 % CAPACITANCE CHANGE
TEMPERATURE qC
-75
-25
0 -4 -6 -8
25
50
125
150
200
M/A-COM MA4M1200 CAPACITOR
-10
CERAMIC CAPACITOR
V3.00 M/A-COM Division of AMP Incorporated s North America: Tel. (800) 366-2266, Fax (800) 618-8883 s Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 s Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Case Style
Chip Style 132 DIM. A B 199 A B 200 A B 201 A B 263 A B
INCHES MIN. 0.020 0.003 0.027 0.004 0.037 0.004 0.047 0.004 -- 0.004 MAX. 0.024 0.008 0.031 0.008 0.041 0.008 0.051 0.008 0.060 0.008
MILLIMETERS MIN. 0.51 0.08 0.69 0.10 0.94 0.10 1.19 0.10 -- 0.10 MAX. 0.61 0.203 0.79 0.203 1.04 0.203 1.30 0.203 1.52 0.203
C
A
B
Note: For "C" dimension on above case styles, see specifications.
Chip Style 350 DIM. A B C 351 A B C
C A
INCHES MIN. 0.018 -- -- 0.018 -- -- 0.018 -- -- 0.020 -- -- 0.018 -- -- 0.018 -- -- MAX. 0.021 0.008 0.009 0.021 0.008 0.012 0.021 0.008 0.015 0.023 0.008 0.018 0.021 0.008 0.013 0.021 0.008 0.016
MILLIMETERS MIN. 0.46 -- -- 0.46 -- -- 0.46 -- -- 0.51 -- -- 0.46 -- -- 0.46 -- -- MAX. 0.53 0.203 0.23 0.53 0.203 0.30 0.53 0.203 0.38 0.58 0.203 0.46 0.53 0.203 0.33 0.53 0.203 0.41
352
A B C
354
A B C
B
358
A B C
359
A B C
V3.00 M/A-COM Division of AMP Incorporated s North America: Tel. (800) 366-2266, Fax (800) 618-8883 s Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 s Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Bonding and Handling Considerations for MNS Chip Capacitors
Handling
Normal precautions that are common to the handling of hybrid semiconductors also apply to MNS chip capacitors. Removal of chips from waffle packs and subsequent handling should be done with a vacuum pencil. Pencils equipped with either metallic or nonmetallic tips are acceptable.
Conductive Epoxy
Any of the conductive epoxies that are available for semiconductor die attachment are acceptable for MNS chip capacitor attachment. Follow the manufacturer's recommendations for mixing and application carefully. Take care to seat the capacitor on the substrate using a soft implement.
Surface Preparation
Each MNS chip and substrate should be free of oils and other surface contamination. Such contaminants may result in poor solder wetting. Cleansing can be done with acetone, alcohol, freon, TMS or other common microelectronic solvents. Burnishing of MNS capacitor chips is not necessary or recommended.
Lead Bonding
Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads are all acceptable methods. Temperature for the pulse bonder should not exceed 300C. Maximum pressure applied to the MNS capacitor chips should not exceed 25 grams for any of the methods used. Proper procedure will result in bond strength that exceeds MIL-STD-883B Method 2011.2 for gold wire or gold ribbon.
Solder
Soldering temperatures up to 300C are acceptable for a duration not greater than 5 seconds for MNS chip capacitors. Any of the common tin-lead-silver, lead-indium, or higher temperature gold alloy solders are acceptable provided that the 300C temperature is not exceeded. Pure tin or tin-antimony solders are not recommended. Cleaning of residual flux is required and can be accomplished with a fluorinated or chlorinated solvent.
V3.00 M/A-COM Division of AMP Incorporated s North America: Tel. (800) 366-2266, Fax (800) 618-8883 s Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087 s Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.

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